As electronic components shrink and circuits become more complex, traditional 2D inspection falls short. Our 3D Inline Automatic Optical Inspection system overcomes these challenges with phase measurement profilometry and a high-speed camera, delivering ultra-precise 3D imaging for components as small as 01005 and 0.3 mm-pitch solder joints.
Equipped with four-direction structured light and 360° LED illumination, the system eliminates blind spots and supports PCB sizes up to 550 x 510 mm. It ensures compliance with IPC-610, enables offline programming, real-time SPC, full traceability, and features interactive 3D defect verification to reduce human error.
Accuracy isn’t optional, it’s essential. PDSTE delivers cutting-edge AOI technology that raises the standard for electronics inspection.